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The Institute of Physics ( IOP ) по журналам "Journal of Micromechanics and Microengineering"

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  • Xinxin Li; Heng Yang; Minhang Bao; Shaoqun Shen; Weiyuan Wang (1999-09-01)
    A novel micromachined composite beam structure has been designed and fabricated using the maskless anisotropic etching technology for 100 steps. The composite beam consists of two beam sections, a horizontal beam and a ...
  • Y Shacham-Diamand (1991-03-01)
    Copper lines with a minimum width of 100 nm were fabricated by selective electroless copper deposition (SED). The deposition reaction is based on the neutralization of positive copper ions in a basic solution by electrons ...
  • W K Schomburg; B Scherrer (1992-09-01)
    Passive microvalves have been fabricated into a 2.7 mu m thin titanium membrane. The valves consist of a perforated thin membrane of polyimide stretched over an opening in the titanium membrane. The diameters of the openings ...
  • N Tirole; D Hauden; P Blind; M Froelicher; L Gaudriot (1993-09-01)
    The fabrication of a 3D silicon linear microactuator is presented. This actuator is realized by anisotropic chemical etching of a (110) oriented silicon wafer. The silicon monolithic structure of the microactuator is ...
  • Dong Youn Sim; Toru Kurabayashi; Masayoshi Esashi (1996-06-01)
    A new bakable pneumatic silicon microvalve has been developed by micromachining for advanced semiconductor device fabrication. This microvalve is composed of an anodically bonded glass - silicon - glass structure and it ...
  • J-S Park; Y B Gianchandani (2000-12-01)
    This paper describes a capacitive absolute-pressure sensor in which the sealed lead transfer is eliminated. The pick-off capacitance is between a flap or skirt-like extension of the flexible diaphragm that reaches past ...
  • M Pedersen; M G H Meijerink; W Olthuis; P Bergveld (1997-09-01)
    A capacitive differential pressure sensor has been developed. The process used for the fabrication of the sensor is IC-compatible, meaning that the device can potentially be monolithically integrated on one chip with a ...
  • Sebastian Böhm; Björn Timmer; Wouter Olthuis; Piet Bergveld (2000-12-01)
    In this paper a closed-loop controlled micromachined dosing system is presented, for the accurate manipulation of liquids in microsystems down to the nanoliter range. The applied driving force to dispense liquids originates from ...
  • David Westberg; Oliver Paul; Gert Andersson; Henry Baltes (1997-09-01)
    We report a CMOS-compatible resonant sensor to measure the density of fluids. The device is fabricated using a standard CMOS process followed by simple post-processing consisting of sacrificial aluminium etching and silicon ...
  • E Peeters; S Vergote; B Puers; W Sansen (1992-09-01)
    A high performance acceleration sensor concept is presented, which combines multiple wafer bonding and differential capacitance measurement into a point-symmetrical design. The accelerometer is a four-layer glass/Si/Si/glass ...
  • J D Holbery; V L Eden (2000-03-01)
    The force constants of a variety of atomic force microscope (AFM) levers were measured using a nanoindentation apparatus attached to an AFM. This method is both non-destructive and precise, with uncertainties in the ...
  • M Elwenspoek; L Smith; B Hok (1992-09-01)
    The authors propose an electrostatic actuator for active joints. The active joint consists of two plates, one of which is a bilayer and bent by the bimorph effect. The plates are clamped to each other at one edge. A voltage ...
  • J Joswig (1992-12-01)
    The author presents a new design of an active micromechanic valve. According to the special design the inlet pressure does not influence the behaviour of the valve. This allows the use of low power actuators. The valve is ...
  • W K Schomburg; J Fahrenberg; D Maas; R Rapp (1993-12-01)
    Active microvalves and micropumps have been manufactured by combining membranes with LIGA structures of metal. These structures have been galvanized on thin titanium membranes. They have been covered by glass platelets to ...
  • Sven Michaelis; Hans-Jörg Timme; Michael Wycisk; Josef Binder (2000-06-01)
    This paper presents an acceleration-threshold sensor fabricated with an electroplating technology which can be integrated on top of a pre-processed CMOS signal processing circuit. The device can be manufactured using ...
  • Raji Krishnamoorthy Mali; Thomas Bifano; David Koester (1999-12-01)
    This paper describes a design-based planarization strategy that can control topography to within submicron levels. The design concept takes advantage of the inherent conformability of the film deposition processes to achieve ...
  • H H Busta; J E Pogemiller; B J Zimmerman (1994-09-01)
    Single tip and arrays of n-type, (100) monocrystalline silicon field emitters were fabricated with a dual-gate structure. The field at the tip can be expressed as E= beta (Vgl+Vgr), in which Vgl and Vgr are the left and ...
  • P-A Clerc; L Dellmann; F Grétillat; M-A Grétillat; P-F Indermühle; S Jeanneret; Ph Luginbuhl; C Marxer; T L Pfeffer; G-A Racine; S Roth; U Staufer; C Stebler; P Thiébaud; N F de Rooij (1998-12-01)
    Advanced deep reactive ion etching (ADRIE) is a new tool for the fabrication of bulk micromachined devices. Different sensors and actuators which use ADRIE alone or combined with other technologies such as surface ...
  • Y B Gianchandani; H Kim; M Shinn; B Ha; B Lee; K Najafi; C Song (2000-09-01)
    A MEMS-first fabrication process for integrating CMOS circuits with polysilicon micromechanical structures is described in detail. The overall process uses 18 masks (22 lithography steps) to merge a p-well LOCOS CMOS process ...
  • J Vandewege; Qingsheng Tan; G De Pestel (1995-12-01)
    A positioning device for accurately positioning an array of multimode fibers with a cladding diameter of 125-140 mu m is described in this paper. The device has grooved sidewalls adapted to hold 16 fibers and includes a ...