Process of spacer with high aspect ratio for field emission display
Sekwang Park; Minsoo Kim; Sekwang Park; Department of Electrical Engineering, Kyungpook National University, 1370 Sankyuk-dong, Buk-ku, Taegu, Korea; Minsoo Kim; Department of Electrical Engineering, Kyungpook National University, 1370 Sankyuk-dong, Buk-ku, Taegu, Korea
Журнал:
Journal of Micromechanics and Microengineering
Дата:
2000-09-01
Аннотация:
To form spacers with a high aspect ratio on an anode plate for field emission displays (FEDs), glass to glass anodic bonding was used. A rib-type soda lime glass, width 100 µm×height 1000 µm×length 75 mm, was used as a spacer and bonded on a 3.54 in mono green color anode plate patterned with Al/Cr film as an interlayer by anodic bonding. To bond the spacers on the anode plate vertically, two types of spacer holders were fabricated and tried with photoetchable glass and an n-type (110) Si wafer. The spacer process was used to fabricate an evacuated FED panel.
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