| Автор | H H Busta |
| Автор | L J Mika |
| Автор | K E Medema |
| Автор | M A Mitchell |
| Дата выпуска | 1994-09-01 |
| dc.description | A fluxless soldering technique has been developed for the attachment of optoelectronic components to silicon submounts by laser soldering of gold-coated indium solder pads. By keeping the solder time per pad at 60 msec, and by adhering to a solder schedule that minimizes the formation of indium oxide, it is possible to solder without flux or the need of an inert atmosphere. The method is demonstrated on a high speed data link consisting of a laser, an external modulator, and a laser back facet detector attached to a silicon submount. |
| Формат | application.pdf |
| Издатель | Institute of Physics Publishing |
| Название | Attachment of optoelectronic components to silicon submounts by Nd:YAG laser soldering of indium |
| Тип | paper |
| DOI | 10.1088/0960-1317/4/3/003 |
| Electronic ISSN | 1361-6439 |
| Print ISSN | 0960-1317 |
| Журнал | Journal of Micromechanics and Microengineering |
| Том | 4 |
| Первая страница | 110 |
| Последняя страница | 115 |
| Аффилиация | H H Busta; Res. Center, Amoco Technol. Co., Naperville, IL, USA |
| Аффилиация | L J Mika; Res. Center, Amoco Technol. Co., Naperville, IL, USA |
| Аффилиация | K E Medema; Res. Center, Amoco Technol. Co., Naperville, IL, USA |
| Аффилиация | M A Mitchell; Res. Center, Amoco Technol. Co., Naperville, IL, USA |
| Выпуск | 3 |
