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Автор W Lang
Автор R Leancu
Автор U Schaber
Автор G Wiedamann
Автор H U Käufl
Дата выпуска 1996-03-01
dc.description While silicon can be easily etched anisotropically using a KOH solution, the anisotropic etching of germanium is difficult to achieve. We describe experiments using different etchants and different masking layers. The best technological results are obtained using a solution of phosphoric acid and hydrogen peroxide . As a mask, a thin film of chromium is preferable. The slow-etching plane is the plane. At , the etch rate is . With this technology it is possible to fabricate V grooves and the other typical structures of anisotropic etching known from silicon technology. One possible application is the production of infrared optical devices in germanium.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Bulk micromachining of Ge for IR gratings
Тип paper
DOI 10.1088/0960-1317/6/1/008
Electronic ISSN 1361-6439
Print ISSN 0960-1317
Журнал Journal of Micromechanics and Microengineering
Том 6
Первая страница 46
Последняя страница 48
Выпуск 1

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