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Автор Gerold Schröpfer
Автор Michel de Labachelerie
Автор Sylvain Ballandras
Автор Pascal Blind
Дата выпуска 1998-06-01
dc.description We present a simple two-step etching process based on anisotropic wet etching of (100) silicon. As one example a system of three seismic masses on one chip has been fabricated. All three masses are symmetrically suspended by four high aspect ratio beams. The highly symmetrical design minimizes mechanical cross-sensitivities. Moreover, the three devices exhibit almost perfect rectangular alignment due to the orientation along the directions of the silicon crystal. Besides experimental results, design rules for the photolithography-masks are presented.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Collective wet etching of a 3D monolithic silicon seismic mass system
Тип paper
DOI 10.1088/0960-1317/8/2/008
Electronic ISSN 1361-6439
Print ISSN 0960-1317
Журнал Journal of Micromechanics and Microengineering
Том 8
Первая страница 77
Последняя страница 79
Выпуск 2

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