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Автор M R Craven
Автор W M Cranton
Автор S Toal
Автор H S Reehal
Дата выпуска 1998-04-01
dc.description Thin films of have been deposited by RF magnetron sputtering onto 100 mm diameter n-type single-crystal Si wafers. Full deposition and post-deposition variables have been investigated with respect to their effect on the dielectric constant and refractive index of the thin films. Specifically for use as insulators for thin film electroluminescent (TFEL) devices, the films need to exhibit a high dielectric constant and a low refractive index. The optimum fabrication route was determined to be deposition at C in a 30% in Ar atmosphere at 7 mTorr with a post-deposition anneal at C for 1 h. Demonstrated here is that films exhibiting suitable characteristics, namely, and n = 2.1, for use in TFEL devices can be fabricated using RF magnetron sputter deposition.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Characterization of thin films deposited by RF magnetron sputtering for use in a.c. TFEL devices
Тип paper
DOI 10.1088/0268-1242/13/4/009
Electronic ISSN 1361-6641
Print ISSN 0268-1242
Журнал Semiconductor Science and Technology
Том 13
Первая страница 404
Последняя страница 409
Выпуск 4

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