| dc.description |
Surface problems in substrates for microcircuits, including methods of measuring substrate cleanliness by radioactive tracer techniques, are discussed. The growth of nuclei in thin films is described and illustrated and deposition techniques for nickel-chromium alloys to form resistors are described in detail, including recently developed stainless-steel resistors. Dielectric films have been studied and nucleation mechanisms for some types of dielectric are outlined. Problems of stress and strain in thin films are also investigated. Reactive sputtering techniques for films of higher permittivity materials are described and details of capacitors given. Practical details of packing density, etc., using microcircuits prepared by these processes are described, and layouts and possible construction methods are suggested. Multiple layer thin film constructions are also described.On semiconductor solid circuits, unijunction transistors have been fabricated in many ways and diffusion, masking, etc., techniques are described for resistors and capacitors. U.S.A. work on computer elements, including the combination of solid circuit elements into complete circuit functions, is described. The hybrid concept of microminiaturization is given and it is concluded that increased reliability can be obtained by the use of solid circuit microminiature techniques combined with the intelligent use of redundancy. |
