The adverse effect of depositing RBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-δ</sub> on nearly perfect lattice matching substrates
Y C Liao; Weiyan Guan; M K Wu; Yi-Da Chiu; C C Chi; Y C Liao; Materials Science Center and Department of Physics, National Tsing Hua University, Hsinchu, Taiwan, Republic of China; Weiyan Guan; Materials Science Center and Department of Physics, National Tsing Hua University, Hsinchu, Taiwan, Republic of China; M K Wu; Materials Science Center and Department of Physics, National Tsing Hua University, Hsinchu, Taiwan, Republic of China; Yi-Da Chiu; Materials Science Center and Department of Physics, National Tsing Hua University, Hsinchu, Taiwan, Republic of China; C C Chi; Materials Science Center and Department of Physics, National Tsing Hua University, Hsinchu, Taiwan, Republic of China
Журнал:
Superconductor Science and Technology
Дата:
2000-07-01
Аннотация:
Despite numerous attempts to optimize the deposition conditions, we have found that there is always a substantial resistive tail below the bulk T<sub>c</sub> of EuBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-δ</sub> and SmBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-δ</sub> films deposited on nearly perfect lattice matching SrTiO<sub>3</sub> (STO) substrates. This is in contrast to the same films deposited on YSZ, LaAlO<sub>3</sub> (LAO) and NdGaO<sub>3</sub> (NGO) substrates under similar conditions. The films on YSZ, LAO and NGO substrates have a sharp resistive transition without any tails, although the lattice match is poorer. We have developed an interpretation of this adverse effect and a simple bi-layer process to get rid of the resistive tails.
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