Crystallite alignment of YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-x</sub> through texture growth
J P Zhou; S X Dou; H K Liu; A J Gouch; M H Apperley; N Savvides; C C Sorrell; J P Zhou; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia; S X Dou; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia; H K Liu; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia; A J Gouch; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia; M H Apperley; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia; N Savvides; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia; C C Sorrell; Sch. of Mater. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia
Журнал:
Superconductor Science and Technology
Дата:
1989-10-01
Аннотация:
Critical current densities of superconducting YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-x</sub> can be increased by several orders of magnitude by sintering processes that encourage textured growth of microcrystals from the melt. Alignment parallel to the a-b planes maximises the conduction within grains, reduces grain boundary resistivity, facilitates oxygen diffusion through vacancies in the a-b planes, and eliminates microcracking resulting from anisotropic thermal expansion. Measured critical current densities in excess of 2400 A cm<sup>-2</sup> at 77 K are limited not by the specimen but by ohmic contact resistance.
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