Preparation of adherent Y-Ba-Cu-O thick films and the effect of silver doping
D K Aswal; S K Gupta; A K Debnath; G P Kothiyal; S C Sabharwal; M K Gupta; D K Aswal; Div. of Tech. Phys. & Prototype Eng., Bhabha Atomic Res. Centre, Bombay, India; S K Gupta; Div. of Tech. Phys. & Prototype Eng., Bhabha Atomic Res. Centre, Bombay, India; A K Debnath; Div. of Tech. Phys. & Prototype Eng., Bhabha Atomic Res. Centre, Bombay, India; G P Kothiyal; Div. of Tech. Phys. & Prototype Eng., Bhabha Atomic Res. Centre, Bombay, India; S C Sabharwal; Div. of Tech. Phys. & Prototype Eng., Bhabha Atomic Res. Centre, Bombay, India; M K Gupta; Div. of Tech. Phys. & Prototype Eng., Bhabha Atomic Res. Centre, Bombay, India
Журнал:
Superconductor Science and Technology
Дата:
1991-05-01
Аннотация:
Thick films of YBa<sub>2</sub>Cu<sub>3</sub>O<sub>x</sub> have been prepared on (100)SrTiO<sub>3</sub> substrates by the paint-on method. The effect of silver doping on the adhesion, void density and superconducting properties of the film has been investigated. The results show that the addition of silver promotes the growth of grains as well as their alignment. It also affects the nature of intergrain connectivity from superconductor-insulator-superconductor (S-I-S) type in undoped samples to superconductor-metal-superconductor (S-N-S).
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