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Автор K Y Choi
Автор J W Lee
Автор H S Choi
Автор J S Yu
Автор M K Han
Автор Y S Kim
Дата выпуска 1997-01-01
dc.description The effects of two-step annealing on the device characteristics of polysilicon thin film transistors are investigated. The device characteristics such as drain current, mobility and threshold voltage of the low temperature furnace annealed polysilicon thin film transistors is improved considerably due to the reduction of in-grain defects by post-laser annealing. The post-high temperature furnace annealing (900°C) on the low temperature furnace annealed devices does not improve the device performance of polysilicon thin film transistors, due to the facts the annealing temperature of 900°C is much lower than the melting temperature (≥ 1300°C) of polysilicon. We have also found that the activation energy and hydrogen passivation rate in two-step annealed polysilicon thin film transistors is also improved significantly by the reduction of tail states due to the elimination of in-grain defects.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Effects of two-step annealing on the characteristics of the low temperature polycrystalline silicon thin film transistors
Тип paper
DOI 10.1088/0031-8949/1997/T69/022
Electronic ISSN 1402-4896
Print ISSN 0031-8949
Журнал Physica Scripta
Том 1997
Первая страница 131
Последняя страница 133
Выпуск T69

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