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Автор P Feichtinger
Автор B Poust
Автор M S Goorsky
Автор D Oster
Автор J Chambers
Автор J Moreland
Дата выпуска 2001-05-21
dc.description We studied the propagation and interaction of individual misfit dislocations in strained p/p<sup>+</sup> Si wafers. Relaxation of misfit strain occurs at the wafer edge during high-temperature epitaxial growth. The thick epitaxial layer (about five times the critical thickness) and low misfit dislocation densities (~100 cm<sup>-1</sup>) are highly compatible with a non-destructive study via x-ray topography. We determined that as a gliding 60° misfit dislocation encounters a strain field in its path, it cross-slips to a specific lattice direction. Misfit dislocation segments with either an orthogonal or quasi-parallel (in the case of the off-oriented substrate) glide direction of the Burger's vector were determined to act as cross-slip initiation sites. This interaction happens during layer growth as well as post-growth annealing cycles. We did not find a case of misfit dislocation blocking during sample annealing. No occurrence of annihilation or multiplication reaction of crossing dislocations was detected during our studies. We show that, due to geometry, a distribution of tilt across the wafer surface results from preferential cross-slipping events. Our results are applicable to early stages of strain relaxation in other strained systems, like graded buffer layers.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Misfit dislocation interactions in low mismatch p/p<sup>+</sup> Si
Тип paper
DOI 10.1088/0022-3727/34/10A/326
Electronic ISSN 1361-6463
Print ISSN 0022-3727
Журнал Journal of Physics D: Applied Physics
Том 34
Первая страница A128
Последняя страница A132
Выпуск 10A

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