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Автор Kitayaporn, Sathana
Автор Hoo, Ji Hao
Автор Böhringer, Karl F
Автор Baneyx, François
Автор Schwartz, Daniel T
Дата выпуска 2010-05-14
dc.description Direct-write nanomanufacturing with scanning beams and probes is flexible and can produce high quality products, but it is normally slow and expensive to raster point-by-point over a pattern. We demonstrate the use of an accelerated direct-write nanomanufacturing method called ‘orchestrated structure evolution’ (OSE), where a direct-write tool patterns a small number of growth ‘seeds’ that subsequently grow into the final thin film pattern. Through control of seed size and spacing, it is possible to vary the ratio of ‘top-down’ to ‘bottom-up’ character of the patterning processes, ranging from conventional top-down raster patterning to nearly pure bottom-up space-filling via seed growth. Electron beam lithography (EBL) and copper electrodeposition were used to demonstrate trade-offs between process time and product quality over nano- to microlength scales. OSE can reduce process times for high-cost EBL patterning by orders of magnitude, at the expense of longer (but inexpensive) copper electrodeposition processing times. We quantify the degradation of pattern quality that accompanies fast OSE patterning by measuring deviations from the desired patterned area and perimeter. We also show that the density of OSE-induced grain boundaries depends upon the seed separation and size. As the seed size is reduced, the uniformity of an OSE film becomes more dependent on details of seed nucleation processes than normally seen for conventionally patterned films.
Формат application.pdf
Издатель Institute of Physics Publishing
Копирайт IOP Publishing Ltd
Название Orchestrated structure evolution: accelerating direct-write nanomanufacturing by combining top-down patterning with bottom-up growth
Тип paper
DOI 10.1088/0957-4484/21/19/195306
Electronic ISSN 1361-6528
Print ISSN 0957-4484
Журнал Nanotechnology
Том 21
Первая страница 195306
Последняя страница 195312
Аффилиация Kitayaporn, Sathana; Department of Chemical Engineering, University of Washington, Seattle, WA 98195-1750, USA
Аффилиация Hoo, Ji Hao; Department of Electrical Engineering, University of Washington, Seattle, WA 98195-1750, USA
Аффилиация Böhringer, Karl F; Department of Electrical Engineering, University of Washington, Seattle, WA 98195-1750, USA
Аффилиация Baneyx, François; Department of Chemical Engineering, University of Washington, Seattle, WA 98195-1750, USA
Аффилиация Schwartz, Daniel T; Department of Chemical Engineering, University of Washington, Seattle, WA 98195-1750, USA
Выпуск 19

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