Fabrication of new micromachined transmission line with dielectric posts for millimeter-wave applications
Han-Shin Lee; Dong-Hoon Shin; Sung-Chan Kim; Byeong-Ok Lim; Tae-Jong Baek; Baek-Seok Ko; Young-Hoon Chun; Soon-Koo Kim; Hyun-Chang Park; Jin-Koo Rhee; Han-Shin Lee; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Dong-Hoon Shin; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Sung-Chan Kim; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Byeong-Ok Lim; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Tae-Jong Baek; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Baek-Seok Ko; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Young-Hoon Chun; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Soon-Koo Kim; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Hyun-Chang Park; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea; Jin-Koo Rhee; Millimeter-Wave Innovation Technology Research Center, Dongguk University, 3-26 Pildong, Joonggu, Seoul 100-175, Korea
Журнал:
Journal of Micromechanics and Microengineering
Дата:
2004-05-01
Аннотация:
This paper describes a new GaAs-based surface-micromachined microstrip line supported by dielectric posts and with an air gap between the signal line and the ground metal. This new type of dielectric post and air-gapped microstripline (DAML) structure was developed using surface micromachining techniques to provide an easy means of air-bridge connection between the signal lines and to achieve low losses in the millimeter-wave frequency band with a wide impedance range. Each DAML is fabricated with a length of 5 mm. By elevating the signal lines from the substrate using micromachining technology, the substrate dielectric loss can be reduced. Compared with conventional microstrip transmission lines, which show over 10 dB cm<sup>−1</sup> loss, the loss of a DAML can be reduced to 1.1 dB cm<sup>−1</sup> at 50 GHz.
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