| Автор | Feng-Tsai Weng |
| Дата выпуска | 2004-05-01 |
| dc.description | In this note, multi-headed microelectrodes were machined by a combined sequence process of WEDG, ultrasonic-aided chemical etching and an electrochemical anodic etching procedure. Electrodes were cut to 0.1 mm by a wire EDM machine from an original diameter of 3 mm in the first step. Electrodes were continually machined by chemical etching and anodic electrochemical etching. During electrolysis, copper impurity produced on the anode is not easily removed from its matrix. A ultrasonic mechanism was utilized to agitate the ferric chloride solution to clean the surface impurity off the electrode. The performance of ultrasonic-aided chemical etching was also studied. Micro single electrodes and foil electrodes were processed by chemical etching. Multi-headed microelectrodes can be machined to 30 µm by the combined sequence etching technology proposed. |
| Формат | application.pdf |
| Издатель | Institute of Physics Publishing |
| Копирайт | 2004 IOP Publishing Ltd |
| Название | Fabrication of microelectrodes for EDM machining by a combined etching process |
| Тип | note |
| DOI | 10.1088/0960-1317/14/5/N01 |
| Electronic ISSN | 1361-6439 |
| Print ISSN | 0960-1317 |
| Журнал | Journal of Micromechanics and Microengineering |
| Том | 14 |
| Первая страница | N1 |
| Последняя страница | N4 |
| Аффилиация | Feng-Tsai Weng; Department of Mechanical Manufacturing Engineering, National Huwei Institute of Technology, Yunlin 632, Taiwan |
| Выпуск | 5 |
