Автор |
Paul Jayachandran Joseph |
Автор |
Hollie A Kelleher |
Автор |
Sue Ann Bidstrup Allen |
Автор |
Paul A Kohl |
Дата выпуска |
2005-01-01 |
dc.description |
The fabrication of air-channels for microelectromechanical systems and microfluidic devices using polynorbornene and polycarbonates as thermally or photolitically decomposable materials to form air-gaps in dielectric materials has been reported. In this study, the incompatibility of some overcoat polymers with the sacrificial materials was addressed. SiO<sub>2</sub> was used as a barrier layer for the fabrication of single- and multi-layer air-channels via different sacrificial and overcoat materials. The structural rigidity of SiO<sub>2</sub> mitigates problems associated with overcoat polymers that can easily deform at the processing temperature (overcoat cure or sacrificial decomposition temperature). The chemical inertness and low permeability of SiO<sub>2</sub> allows the use of solvent-cast polymers, for which the solvents would have otherwise dissolved the sacrificial material. |
Формат |
application.pdf |
Издатель |
Institute of Physics Publishing |
Копирайт |
2005 IOP Publishing Ltd |
Название |
Improved fabrication of micro air-channels by incorporation of a structural barrier |
Тип |
paper |
DOI |
10.1088/0960-1317/15/1/006 |
Electronic ISSN |
1361-6439 |
Print ISSN |
0960-1317 |
Журнал |
Journal of Micromechanics and Microengineering |
Том |
15 |
Первая страница |
35 |
Последняя страница |
42 |
Аффилиация |
Paul Jayachandran Joseph; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA |
Аффилиация |
Hollie A Kelleher; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA |
Аффилиация |
Sue Ann Bidstrup Allen; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA |
Аффилиация |
Paul A Kohl; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA |
Выпуск |
1 |