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Автор Paul Jayachandran Joseph
Автор Hollie A Kelleher
Автор Sue Ann Bidstrup Allen
Автор Paul A Kohl
Дата выпуска 2005-01-01
dc.description The fabrication of air-channels for microelectromechanical systems and microfluidic devices using polynorbornene and polycarbonates as thermally or photolitically decomposable materials to form air-gaps in dielectric materials has been reported. In this study, the incompatibility of some overcoat polymers with the sacrificial materials was addressed. SiO<sub>2</sub> was used as a barrier layer for the fabrication of single- and multi-layer air-channels via different sacrificial and overcoat materials. The structural rigidity of SiO<sub>2</sub> mitigates problems associated with overcoat polymers that can easily deform at the processing temperature (overcoat cure or sacrificial decomposition temperature). The chemical inertness and low permeability of SiO<sub>2</sub> allows the use of solvent-cast polymers, for which the solvents would have otherwise dissolved the sacrificial material.
Формат application.pdf
Издатель Institute of Physics Publishing
Копирайт 2005 IOP Publishing Ltd
Название Improved fabrication of micro air-channels by incorporation of a structural barrier
Тип paper
DOI 10.1088/0960-1317/15/1/006
Electronic ISSN 1361-6439
Print ISSN 0960-1317
Журнал Journal of Micromechanics and Microengineering
Том 15
Первая страница 35
Последняя страница 42
Аффилиация Paul Jayachandran Joseph; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA
Аффилиация Hollie A Kelleher; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA
Аффилиация Sue Ann Bidstrup Allen; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA
Аффилиация Paul A Kohl; School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0100, USA
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