| Автор | Y L Koh |
| Автор | W K Chiu |
| Дата выпуска | 2003-08-01 |
| dc.description | The application of the impedance method and the transfer function method to detect disbonds in bonded repairs has been investigated using finite-element analysis. The damages simulated are typical disbonds that can occur in bonded repairs. This paper shows that both the impedance method and the transfer function method can be used to detect disbond growth under the repair patch within the limitations set out. By strategically locating the sensor and actuator pair, the location, type and severity of a disbond in a repair patch can be determined. |
| Формат | application.pdf |
| Издатель | Institute of Physics Publishing |
| Название | Numerical study of detection of disbond growth under a composite repair patch |
| Тип | paper |
| DOI | 10.1088/0964-1726/12/4/314 |
| Electronic ISSN | 1361-665X |
| Print ISSN | 0964-1726 |
| Журнал | Smart Materials and Structures |
| Том | 12 |
| Первая страница | 633 |
| Последняя страница | 641 |
| Аффилиация | Y L Koh; Monash University, Wellington Road, Clayton, 3800, Victoria, Australia |
| Аффилиация | W K Chiu; Monash University, Wellington Road, Clayton, 3800, Victoria, Australia |
| Выпуск | 4 |
