Materials for inductive and microwave function integration in LTCC-technology multichip modules
V T Zaspalis; M Kolenbrander; J Boerekamp
Журнал:
Journal of Physics: Conference Series
Дата:
2005-01-01
Аннотация:
Low Temperature cofired ceramics technology (LTCC) receives considerable industrial interest as a multichip module integration technology, particularly because its very good performance-cost combination. The integration potential of the LTCC technology will be significantly extended with the availability of LTCC-compatible low firing magnetic materials that will enable the integration of high frequency inductive functions. In this article the preparation of low firing cobalt containing hexagonal ferrite materials of the Z-structure (Ba<sub>3</sub>Co<sub>2</sub>Fe<sub>24</sub>O<sub>41</sub>, or Co-Z) is described using a PbO-WO<sub>3</sub> eutectic mixture as liquid phase sintering additive. Layers from the previous materials are prepared by the slip-casting technique and cofired with commercially available, low dielectric constant, LTCC tapes. Crack free multilayer structures are achieved after firing at 950-1000°C.
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