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Автор M C Acero
Автор A Perez-Rodriguez
Автор J Esteve
Автор J Montserrat
Автор B Garrido
Автор A Romano-Rodriguez
Автор J R Morante
Дата выпуска 1993-09-01
dc.description The analysis of the etch-stop properties of layers obtained by substoichiometric nitrogen-ion implantation and annealing in silicon has been performed as a function of the implantation conditions. The analysis of the etching efficiency has been tested in TMAH-IPA systems. The results obtained show the need to implant at doses higher than 2*10<sup>17</sup> cm<sup>-2</sup> to obtain etch-stop layers stable under high-temperature annealing. So, for implantation doses of 5*10<sup>17</sup>cm<sup>-2</sup>, layers stand unetched for times longer than 2 h. The preliminary structural analysis of the samples suggests the presence of an amorphous silicon nitride layer for higher implantation doses.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Analysis of buried etch-stop layers in silicon by nitrogen-ion implantation
Тип paper
DOI 10.1088/0960-1317/3/3/012
Electronic ISSN 1361-6439
Print ISSN 0960-1317
Журнал Journal of Micromechanics and Microengineering
Том 3
Первая страница 143
Последняя страница 145
Аффилиация M C Acero; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
Аффилиация A Perez-Rodriguez; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
Аффилиация J Esteve; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
Аффилиация J Montserrat; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
Аффилиация B Garrido; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
Аффилиация A Romano-Rodriguez; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
Аффилиация J R Morante; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain
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