Автор |
M C Acero |
Автор |
A Perez-Rodriguez |
Автор |
J Esteve |
Автор |
J Montserrat |
Автор |
B Garrido |
Автор |
A Romano-Rodriguez |
Автор |
J R Morante |
Дата выпуска |
1993-09-01 |
dc.description |
The analysis of the etch-stop properties of layers obtained by substoichiometric nitrogen-ion implantation and annealing in silicon has been performed as a function of the implantation conditions. The analysis of the etching efficiency has been tested in TMAH-IPA systems. The results obtained show the need to implant at doses higher than 2*10<sup>17</sup> cm<sup>-2</sup> to obtain etch-stop layers stable under high-temperature annealing. So, for implantation doses of 5*10<sup>17</sup>cm<sup>-2</sup>, layers stand unetched for times longer than 2 h. The preliminary structural analysis of the samples suggests the presence of an amorphous silicon nitride layer for higher implantation doses. |
Формат |
application.pdf |
Издатель |
Institute of Physics Publishing |
Название |
Analysis of buried etch-stop layers in silicon by nitrogen-ion implantation |
Тип |
paper |
DOI |
10.1088/0960-1317/3/3/012 |
Electronic ISSN |
1361-6439 |
Print ISSN |
0960-1317 |
Журнал |
Journal of Micromechanics and Microengineering |
Том |
3 |
Первая страница |
143 |
Последняя страница |
145 |
Аффилиация |
M C Acero; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Аффилиация |
A Perez-Rodriguez; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Аффилиация |
J Esteve; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Аффилиация |
J Montserrat; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Аффилиация |
B Garrido; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Аффилиация |
A Romano-Rodriguez; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Аффилиация |
J R Morante; Centro Nacional de Microelectronica, Campus Univ. Autonoma de Barcelona, Spain |
Выпуск |
3 |