The ganging of silicon carbide disks for the slow speed multi-cutting of brittle semiconducting dice is described. With twelve 0·125 mm disks and spacing collars as required (e.g. 0·25 or 0·5 mm), one hundred and twenty one dice were produced in two cutting operations with an accuracy to better than 25 μm and minimal chipping. It is concluded that the process could be readily expanded to employ up to fifty disks and a yield of approximately 2400 dice and that the use of silicon carbide disks is suitable economically.