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Автор Li, Mingtao
Автор Chen, Lei
Автор Zhang, Wei
Автор Chou, Stephen Y
Дата выпуска 2003-01-01
dc.description We studied the pattern transfer fidelity of nanoimprint lithography (NIL) by patterning sub-micron MESFET gates on six-inch wafers. The critical dimensions (CD) of the gate patterns on the mould, imprinted in resist, as well as after oxygen reactive ion etching (RIE) and metal lift-off were measured, separately, using an ultrahigh-resolution scanning electron microscope. Comparison of the measurements reveals that the as-imprinted gates in resist are 5.2 (or 37 nm) on average larger than those on the mould with a standard deviation of 1.2 (or 8 nm), and the gates after oxygen RIE and metal lift-off are 42 (or 296 nm) on average larger than those on the mould with a standard deviation of 8 (or 30 nm). Compared with photolithography, NIL has better pattern transfer fidelity with CD controls about four times smaller.
Формат application.pdf
Издатель Institute of Physics Publishing
Название Pattern transfer fidelity of nanoimprint lithography on six-inch wafers
Тип paper
DOI 10.1088/0957-4484/14/1/308
Electronic ISSN 1361-6528
Print ISSN 0957-4484
Журнал Nanotechnology
Том 14
Первая страница 33
Последняя страница 36
Аффилиация Li, Mingtao; NanoStructure Laboratory, Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, USA
Аффилиация Chen, Lei; NanoOpto Corporation, 1600 Cottontail Lane, Somerset, NJ 08873, USA
Аффилиация Zhang, Wei; NanoOpto Corporation, 1600 Cottontail Lane, Somerset, NJ 08873, USA
Аффилиация Chou, Stephen Y; NanoStructure Laboratory, Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, USA
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