Dimensional measurement of 3D microstruture based on white light interferometer
S C H Thian; W Feng; Y S Wong; J Y H Fuh; H T Loh; K H Tee; Y Tang; L Lu; S C H Thian; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; W Feng; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; Y S Wong; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; J Y H Fuh; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; H T Loh; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; K H Tee; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; Y Tang; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576; L Lu; Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1, Singapore 117576
Журнал:
Journal of Physics: Conference Series
Дата:
2007-07-01
Аннотация:
Dimensional metrology for micro/nano structure is crucial for addressing quality issues and understanding the performance of micro-fabricated products and micro-fabrication processes. Most of the established methods are based on optical microscopy for planar dimensions and stylus profilometry for out-of-plane dimensions. Contact profilers suffer from slow speed of measurement for three-dimensional profiles and are not suitable for delicate surfaces and parts. Advanced systems using white light interferometer are equipped with CCD cameras and interfaced with a microscope to conduct an array of measurements ranging from two-dimensional to three-dimensional profiles and surface roughness analysis. This paper presents a methodology based on white light interferometer for the dimensional measurement of 3D micro-structures, demonstrated on micro-gears and moulds produced by UV lithography and vacuum casting, respectively. Physical artifacts, such as gauge blocks, are also utilized to verify and validate the measurements on the microcomponents.
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