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Автор Kropman, D
Автор Mellikov, E
Автор Karner, T
Автор Medvid, A
Автор Onufrijevs, P
Автор Dauksta, E
Дата выпуска 2011-12-02
dc.description The results of the investigation of stresses relaxation by strain by means of EPR spectra, IR absorption spectra, scanning electron microscopy and samples deflection are presented. It is shown that stresses relaxation mechanism depend on the oxidation condition: temperature, cooling rate and oxide thickness. In the Si-SiO<sub>2</sub>-Si<sub>3</sub>N<sub>4</sub> system the stresses relaxation by the strain occurs due to the opposite sign of the thermal expansion coefficient of Si-SiO<sub>2</sub> and Si<sub>3</sub>N<sub>4</sub> on Si. Laser irradiation allows modifying the system stresses.
Формат application.pdf
Издатель Institute of Physics Publishing
Копирайт Published under licence by IOP Publishing Ltd
Название Stress relaxation mechanism by strain in the Si-SiO<sub>2</sub> system and its influence on the interface properties
Тип paper
DOI 10.1088/1757-899X/25/1/012018
Electronic ISSN 1757-899X
Print ISSN 1757-8981
Журнал IOP Conference Series: Materials Science and Engineering
Том 25
Первая страница 12018
Последняя страница 12020
Аффилиация Kropman, D; Tallinn University of Technology, Ehitajate tee 5, 19086 Tallinn, Estonia;
Аффилиация Mellikov, E; Tallinn University of Technology, Ehitajate tee 5, 19086 Tallinn, Estonia
Аффилиация Karner, T; Institute of Physics, University of Tartu, Riia 142, 51014 Tartu, Estonia
Аффилиация Medvid, A; Riga Technical University, 14 Azenes Str., LV-1048, Riga, Latvia
Аффилиация Onufrijevs, P; Riga Technical University, 14 Azenes Str., LV-1048, Riga, Latvia
Аффилиация Dauksta, E; Riga Technical University, 14 Azenes Str., LV-1048, Riga, Latvia
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