| Автор | Honma, H. |
| Автор | Komatsuzawa, T. |
| Дата выпуска | 1988 |
| dc.description | ABSTRACTAlumina ceramics are. widely used for LSI packages and printed circuit and sensor materials. For many of these applications, metallization of the surface is required. In general,this is performed by applying a conductive paste on the ceramic surfaceAn alternative approach is the subject of this paper. A wet process involving etching, catalytic activation, and electroless plating was investigated to deposit a nickel film with excellent adhesion. To obtain good adhesion of electroless nickel on alumina ceramics, ammonium fluoride etching, stannous chloride sensitizing and palladium chloride activation were used sequentially as preplating treatments. A dilute nickel bath with a 1:4 molar ratio of Ni to hypophosphite and a pH of 6 was optimal. Purging the bath with an inert gas improved nickel adhesion. |
| Формат | application.pdf |
| Издатель | Taylor & Francis Group |
| Копирайт | Copyright Taylor and Francis Group, LLC |
| Название | ADHESION STRENGTH OF ELECTROLESS NICKEL DEPOSITS ON ALUMINA CERAMIC SUBSTRATE |
| Тип | research-article |
| DOI | 10.1080/10426918808953208 |
| Print ISSN | 0898-2090 |
| Журнал | Advanced Materials and Manufacturing Processes |
| Том | 3 |
| Первая страница | 291 |
| Последняя страница | 308 |
| Аффилиация | Honma, H.; Kanto Gakuin University |
| Аффилиация | Komatsuzawa, T.; Kanto Gakuin University |
| Выпуск | 2 |
