ABSTRACTCopper films of coverage coefficients ranging between 0 · 2 and 1 were evaporated onto glass substrates under vacuum conditions (p ≃ 10⁻⁸Torr). For these films, the temperature dependences of resistance were measured in vacuo in situ. Making use of the data obtained, TCR values as a function of coverage coefficient and the activation energy for films with different coverage coefficients were established. The film resistance was found to change, and TCR values approached zero for coverage coefficients between 0 · 63 and 0 · 75. This interval (Δq _c) can be regarded as the percolation interval for discontinuous Cu films.