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Автор Hsu, J.-T.
Автор Lin, C.-S.
Автор Jensen, M.-K.
Дата выпуска 1993
dc.description The effect of thermal environment on boiling heat transfer performance in a section of a horizontal tube bundle was investigated using R-113 as the working fluid. The in-line tube bundle has five columns and 27 rows with a pitch-to-diameter ratio of 1.3. Heal transfer coefficients obtained from the instrumented tube in the tube bundle with only one tube heated while the other tubes remained unhealed and with all the lubes in the bundle heated are reported for a range of heat flux, pressure, mass flow rate, and quality. The results showed that heat transfer coefficient of a tube in a heated bundle is slightly higher than that in an unhealed bundle, with the variation of heat transfer coefficient decreasing as heat flux, mass flow rate, or pressure increased. It was also found that higher quality would tend to improve the heat transfer. However, the effect of quality disappeared as heat flux, mass flow rate, and pressure increased. Based on the experimental data, the mechanism of the heat transfer augment due to thermal environment was analyzed. It was proposed that fluid agitation and thin liquid film formation are two main factors for a heated bundle to have better transfer performance than an unhealed bundle,
Формат application.pdf
Издатель Taylor & Francis Group
Копирайт Copyright Taylor and Francis Group, LLC
Название BOILING HEAT TRANSFER MECHANISMS IN A HORIZONTAL TUBE BUNDLE
Тип research-article
DOI 10.1080/08916159308946458
Electronic ISSN 1521-0480
Print ISSN 0891-6152
Журнал Experimental Heat Transfer
Том 6
Первая страница 259
Последняя страница 271
Аффилиация Hsu, J.-T.; Energy Science & Technology Research Center Department of Mechanical Engineering, Yuan-Ze Institute of Technology
Аффилиация Lin, C.-S.; Energy Science & Technology Research Center Department of Mechanical Engineering, Yuan-Ze Institute of Technology
Аффилиация Jensen, M.-K.; Department of Mechanical Engineering Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute
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