| Автор | Reuss, Robert H. |
| Автор | Chalamala, Babu R. |
| Дата выпуска | 2003 |
| dc.description | AbstractThe focus of this issue of MRS Bulletin is to explore the impact of materials science and technology on microelectronics packaging and integration. Progress in microelectronics packaging has been intimately tied to the continuous advances made in the associated materials, process technologies, and design tools. This is especially true now, as packaging moves into an era driven by the need for complex system-level solutions. This issue is our attempt to present the current status of microelectronics packaging technology and integration and to highlight various perspectives on the future evolution of the field. |
| Формат | application.pdf |
| Издатель | Cambridge University Press |
| Копирайт | Copyright © Materials Research Society 2003 |
| Тема | microelectronics packaging and integration |
| Тема | microelectronic materials |
| Тема | technology roadmaps |
| Тема | Technical Feature |
| Название | Microelectronics Packaging and Integration |
| Тип | research-article |
| DOI | 10.1557/mrs2003.13 |
| Electronic ISSN | 1938-1425 |
| Print ISSN | 0883-7694 |
| Журнал | MRS Bulletin |
| Том | 28 |
| Первая страница | 11 |
| Последняя страница | 20 |
| Выпуск | 1 |
