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Автор Rousset, V.
Автор Joachim, C.
Автор Ondarçuhu, T.
Автор Rousset, B.
Дата выпуска 1998
dc.description Planar metal/semiconductor/metal (PMSM) junctions buried in a SiO<sub>2</sub> layer are fabricated using electron beam lithography on a silicon sample. A technique of jump of pixels is used to obtain different sizes of junctions, the smallest having an inter-electrode distance of 5 nm. The current-voltage characteristics and the variation of the junction conductance with the temperature down to 8 K have been studied. At all sizes and for both polarities, the I−V curves correspond to the reverse characteristic of a metal/semiconductor contact. At low bias voltage, the influence of a thin insulator interfacial layer between the metal and the semiconductor has been pointed out. For these junctions, a non-linear low voltage I−V characteristics is observed before the large voltage thermionic emission regime. For the smallest junctions obtained without interfacial oxide layer, a linear I−V characteristic is recovered at low voltage. Their conductance can be lowered by decreasing the temperature.
Формат application.pdf
Издатель EDP Sciences
Копирайт © EDP Sciences, 1998
Название I−V characteristics of co-planar metal-semiconductor-metal nanojunctions
Тип research-article
DOI 10.1051/epjap:1998199
Electronic ISSN 1286-0050
Print ISSN 1286-0042
Журнал The European Physical Journal Applied Physics
Том 3
Первая страница 21
Последняя страница 28
Аффилиация Rousset V.; CEMES-LOE/CNRS, 29 rue J. Marvig, BP 4347, 31055 Toulouse Cedex, France
Аффилиация Joachim C.; CEMES-LOE/CNRS, 29 rue J. Marvig, BP 4347, 31055 Toulouse Cedex, France
Аффилиация Ondarçuhu T.; CEMES-LOE/CNRS, 29 rue J. Marvig, BP 4347, 31055 Toulouse Cedex, France
Аффилиация Rousset B.; LAAS/CNRS, 7 avenue du Colonel Roche, 31077 Toulouse Cedex, France
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