Incorporation modes of silicon in GaAs: Si grown by metalorganic vapor phase epitaxy
Beji, L.; Rebey, A.; El Jani, B.; Beji L.; Laboratoire de Physique des Matériaux, Faculté des Sciences, TN-5000 Monastir, Tunisia; Rebey A.; Laboratoire de Physique des Matériaux, Faculté des Sciences, TN-5000 Monastir, Tunisia; El Jani B.; Laboratoire de Physique des Matériaux, Faculté des Sciences, TN-5000 Monastir, Tunisia
Журнал:
The European Physical Journal Applied Physics
Дата:
1998
Аннотация:
The incorporation of silicon from SiH<sub>4</sub> in GaAs has been studied on a wide range of growth conditions by atmospheric pressure metalorganic vapor phase epitaxy (AP-MOVPE). The highest free carrier concentration exceeds 1 × 10<sup>19</sup> cm<sup>−3</sup>. Compensation ratios appear to be strongly dependent on the SiH<sub>4</sub> partial pressure. The relatively high compensation ratios essentially originate from the amphoteric behaviour of silicon. The temperature dependence of silicon doping has been investigated in the range 650 °C to 765 °C with various silane partial pressures. The activation energy of Si incorporation varies from 0 to 2.2 eV. The dependence of the free electron concentration on the arsine partial pressure (P <sub>AsH<sub>3</sub> </sub>) leads to the empirical relationship: n = aP <sub>AsH<sub>3</sub> </sub> + $bP_{AsH_3}^{-\frac{4}{3}$, which describes the relationship between silicon doping concentration and arsine partial pressure.
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